Embedded Flash in 0.25 micron Announced by TSMC

	Embedded Flash in 0.25 micron Announced by TSMC

	Company:	Taiwan Semiconductor Massachusetts
	Category:	Other
	Date:	22-Dec-1999

	Hsin-chu, Taiwan (microcontroller.com) - Taiwan Semiconductor Manufacturing Company TSMC has introduced an 0.25µ flash cell to its family of patented embedded flash technologies, or EmbFlash™. TSMC is one of the few manufacturers of cost-efficient program memory Flash cells that pass most vendor quality standards. Presently, TSMC has embedded flash cells in geometries of 0.5µ and 0.35µ that are used by microcontroller manufacturers such as Motorola, National Semiconductor, and Scenix. The use of embedded flash has been gaining in popularity in recent years. On-chip flash provides several advantages in microcontroller-based systems: In-System programmability allows for the microcontroller to be programmed in the field without having to change components. Significant space is saved by reducing the number of external components Component reduction adds to the reliability of most systems. In some systems, reduced power consumption may be evidenced. According to TSMC, 0.25um EmbFlash™ is ideal for applications requiring high-density flash, particularly, wireless data devices such as cellular phones and PDAs. TSMC provides the Flash IP (FlashIP™) and SRAM IP in support of flash densities up to 32Mb and SRAM densities up to 4Mb, thereby increasing design flexibility and accelerate time-to-market for customers' designs. Wireless designs, especially those in the cellular market, often employ multi-chip module (MCM) solutions that integrate separate microcontroller and flash dies in a single package. While MCMs may achieve design density, MCMs are highly susceptible to temperature extremes and also can generate excess EMI. Microcontrollers with flash on-chip provide a superior alternative for vendors to differentiate their products in performance, features, and temperature stability. "Compared to the MCM solutions used in the cellular phone, the EmbFlash™ solution can further improve the power, performance, and even cost," said Sam Chu, the director of Embedded Non-Volatile Memory at TSMC. "Our FlashIP™ set features combined density, configuration, and performance improvements that simply aren't available from stand-alone memory. In addition, the design and test support from TSMC enables our customers to integrate flash and SRAM with greater ease and minimum overhead." Availability TSMC is presently accepting customer tape-outs for its 0.25µ embedded flash process. The company is also pursuing a next-generation, 0.18-micron EmbFlash™ technology, which is scheduled for release late 2000. About TSMC TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading-edge foundry services. TSMC operates five eight-inch wafer fabs (Fab 3, 4, 5, TASMC and WaferTech), and two six-inch wafer fabs (Fabs 1 and 2). In addition, the company is ramping Fab 6, located in Tainan Taiwan, for production and has begun construction of a $1.2 billion joint venture fab with Philips Semiconductor, which is scheduled to open in Singapore in 2000. TSMC has broken ground for a new 12-inch wafer fabrication facility in Hsin-Chu and will soon break ground for fab 7 in Tainan, which will be the company's sixth eight-inch fab. In year 2000, TSMC will have the capacity for nearly 3 million 8-inch equivalent wafers. Fabrication processes offered by TSMC include CMOS logic, mixed-mode, volatile and non-volatile memory, and BiCMOS. TSMC's corporate headquarters are in Hsin-Chu, Taiwan.

Microcontrollers for Embedded Systems Designers

Embedded Flash in 0.25 micron Announced by TSMC

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